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RN -41 -DS
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Figure 5. Minimizing Radio Interference
1.5 mm
Do not located any surface
parts, surface traces, internal
traces, or ground planes under
the antenna area.
13.4 mm
1.5 mm
7.0 mm
1
2
3
4
5
6
7
8
9
10
Do not locate vias
or surface traces
under shield
connectors
(1.5 mm square).
24
23
22
21
10
19
18
17
16
15
25.6 mm
1.5 mm
11
12
35
29
33
34
31
32
28
30
14
13
1.5 mm
Bottom View
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Because the RN-41-N does not contain an antenna, it does not carry regulatory approvals.
If designers use Roving Networks recommended design, they can file for a permissible antenna change and use Roving
Networks’ regulatory approvals. Roving Networks recommends the Yageo chip antenna for the RN-41-N module. For
detailed information on this antenna, refer to the Yageo chip antenna data sheet on the Support page of the Roving
Networks website at http://www.rovingnetworks.com/Support_Overview .
If designers choose to use another antenna, they must go through the regulatory approval process.
Solder Reflow Profile
The lead-free solder reflow temperature and times are:
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Temperature —230 ° C, 30 - 40 seconds, peak 250 ° C maximum
Preheat temperature —165 ° ± 15 ° C, 90 to 120 seconds
Time —Single pass, one time
www.rovingnetworks.com
Version 3.3r 4/9/2012
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相关代理商/技术参数
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制造商:未知厂家 制造商全称:未知厂家 功能描述:RN-41/RN-41-N Class 1 Bluetooth Module
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制造商:未知厂家 制造商全称:未知厂家 功能描述:RN-41/RN-41-N Class 1 Bluetooth Module
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